Core Responsibilities Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers, with OSAT or at internal line. Process Pathfinding & Integration: Design and optimize early-stage process
Job Description: Position: Technical Sales & Service Engineer Reports To: Business Development Manager – Functional Electronic Coatings Position Summary: As a Technical Sales & Service Engineer, you will be responsible for driving business growth by providing both technical
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners.
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners.
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the
Responsibilities: Plating Process Engineering · Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.) · Monitor plating bath performance through regular analysis and corrective actions · Perform DOE, capability studies, and process qualification for new plating chemistry
Division: Technology & Manufacturing Group Employment Status: Exempt Salary Grade: 104 Shift: Requisition ID: 78028 Please be aware that if you are selected to formally interview for an internal position you will be required to notify your current
Responsibilities: · Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer · Maintains documentation of customer projects starting from Kick-off, Engineering
Responsibilities: · Develop, qualify, and maintain wet etch, clean, and stripping processes for semiconductor wafer fabrication and advanced packaging applications. · Optimize process parameters to achieve target specifications for critical dimensions, surface cleanliness, and defect performance.