Responsibilities The Silicon Platform Team acts as the core R&D middleware group for chip development within the company. The team covers the full spectrum of the chip design flow, including Logic Synthesis, Design for Testability (DFT),
About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for
Summary The WLP Development Engineer will support R&D and process integration activities for 2.5D wafer-level packaging (WLP)technologies, focusing on Die Preparation, Chip Attach, and Moldingprocesses. The role ensures process reliability, manufacturability, and seamless integration for next-generation semiconductor packages used in
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we
Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we
Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we
About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Locations: Singapore, Singapore Categories: Engineering Req ID: 91988 ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to
About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for
Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the
About Lumilens At Lumilens, we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is ushering in a new era of computing that is
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Core Responsibilities Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball
Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we
Core Responsibilities Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting
Summary •To design and develop advanced photolithography processes and materials tailored to customer product requirements, optimize process performance and yield, and ensure robust and reliable production in semiconductor advanced packaging. Job • Design and development of photolithography processes
Job Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes Operate and optimize 2D/3D AOI systems and inspection parameters Configure AOI inspection algorithms for new product designs Set up process conditions and